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FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
August 2005 Revised August 2005
FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
General Description
The FSUSB23 is a low power high bandwidth analog switch specifically designed for high speed USB 2.0 applications. The FSUSB23 features very low quiescent current even when the control voltage is lower than the VCC supply. This feature services mobile handset applications well allowing for direct interface with the baseband processor general purpose I/Os. Typical applications involve switching in portables and consumer applications such as cell phones, digital cameras, and notebooks with hubs or controllers. The wide bandwidth (>720MHz) of this switch exceeds the bandwidth needed to pass the 3rd harmonic which results in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk results in minimal interference.
Features O 10PA maximum ICCT current over an expanded control
voltage range (VIN = 2.6V, VCC = 3.6V)
O Lower Capacitance: Con = 9pF Typ O 7: typical On Resistance (RON) O 3dB bandwidth: > 720MHz O Low power consumption (1PA maximum) O Packaged in:
Pb-Free 10-lead MicroPak (1.6mm by 2.1mm) Pb-Free 16-lead DQFN
O 7kV I/O to GND ESD performance
Applications O Cell phone, PDA, Digital Camera, and Notebook O LCD Monitor, TV, and Set-top Box
Ordering Code:
Order Number
FSUSB23L10X FSUSB23BQX
Package Number
MAC010A MLP016E
Package Description
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm
Pb-Free package per JEDEC J-STD-020B.
MicroPak is a trademark of Fairchild Semiconductor Corporation.
(c) 2005 Fairchild Semiconductor Corporation
DS500925
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FSUSB23
Analog Symbol
Connection Diagrams
Pad Assignments for MicroPak
Pin Descriptions
Pin Name
OE S D+, D, Dn+, Dn
(Top View) Pad Assignments for DQFN
Description
Bus Switch Enable Select Input Data Ports
Truth Table
S
X L H
OE
H L L
Function
Disconnect D+, D = D1n D+, D = D2n
(Top Through View)
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FSUSB23
Absolute Maximum Ratings(Note 1)
Supply Voltage (VCC) DC Switch Voltage (Note 2) DC Input Voltage (VIN) (Note 2) DC Input Diode Current DC Output Current Storage Temperature ESD (Human Body Model) All Pins I/O to GND 7 KV 7 KV
Recommended Operating Conditions
(Note 3) Supply Voltage VCC Control Input Voltage Switch Input Voltage Operating Temperature Thermal Resistance 10 MicroPak 250qC/w 3.0V to 3.6V 0V to VCC 0V to VCC
0.5V to +4.6V 0.5V to VCC + 0.5V 0.5v to +4.6V 50mA
50mA
40qC to +85qC
65qC to +150qC
Note 1: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The Recommended Operating Conditions tables will define the conditions for actual device operation. Note 2: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. DC switch voltage may never exceed 4.6V. Note 3: Control input must be held HIGH or LOW and it must not float.
DC Electrical Characteristics (All typical values are @ 25qC unless otherwise specified.)
Symbol VIK VIH VIL IIN IOZ RON Parameter Clamp Diode Voltage Input Voltage HIGH Input Voltage LOW Control Input Leakage OFF State Leakage Switch On Resistance 3.0 (Note 4) 7.0 3.0 3.0 3.6 3.6 0.3 2.0 1.0 10.0 10.0 Delta RON (Note 5) RON Flatness (Note 4) Quiescent Supply Current Increase in ICC Current per Control Voltage and VCC Levels 6.0 VCC (V) 3.0 3.0 to 3.6 3.0 to 3.6 3.6 1.2 0.50 Min TA = 40qC to +85qC Typ Max Units Conditions IIN = 18mA
1.2
V V V
r1.0 r1.0
9.0
A A X X X A A
VIN = 0V to VCC 0 d Dn, D1n, D2n d VCC VIN = 0.4V, ION = 8mA VIN = 0.8V, ION = 8mA VIN = 0.8V, ION = 8mA VIN = 0.0V 1.0V, ION = 8mA VIN = 0.0V or VCC, IOUT = 0 VIN = 2.6V VCC = 3.6V
9RON
RON Flatness ICC ICCT
Note 4: Measured by the voltage drop between Dn, D1n, D2n pins at the indicated current through the switch. On Resistance is determined by the lower of the voltage on the two ports. Note 5: Guaranteed by characterization.
AC Electrical Characteristics (All typical values are for VCC = 3.3v @ 25qC unless otherwise specified.)
Symbol tON tOFF tPD OIRR Xtalk BW Turn On Time Parameter S, OE to Output VCC (V) 3.0 to 3.6 3.0 to 3.6 3.3 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 TA = 40qC to +85qC Min Typ 10.0 8.0 0.25 Max 13.0 11.0 ns ns ns dB dB MHz VD1n, D2n = 0.8V, RL = 50XACL = 10X VD1n, D2n = 0.8V, RL = 50XACL = 10X CL = 10 pF f = 250MHz, RL = 50X RL = 50X, f = 250MHz RL = 50X Figure Units Conditions Number Figure 5 Figure 5 Figures 3, 4 Figure 8 Figure 9 Figure 7
Turn OFF Time S, OE to Output Propagation Delay (Note 6) OFF Isolation (Non-Adjacent) Non-Adjacent Channel Crosstalk
30.0 43.0
720
3dB Bandwidth
Note 6: Guaranteed by characterization
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FSUSB23
USB Related AC Electrical Characteristics
Symbol tSK(O) tSK(P) tJ Parameter Channel-to-Channel Skew (Note 7) Skew of Opposite Transitions of the Same Output (Note 7) Total Jitter (Note 7) VCC (V) 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 TA = 40qC to +85qC Min Typ 40.0 20.0 150 Max ps ps ps CL = 10pF CL = 10pF RL = 50X, CL = 10pF, tR = tF = 750ps at 480 Mbps (PRBS = 215 1) Note 7: Guaranteed by design. Figure Units Conditions Number Figures 3, 6 Figures 3, 6
Capacitance
Symbol CIN CON COFF Parameter Min Control Pin Input Capacitance D1n, D2n, Dn ON Capacitance D1n, D2n OFF Capacitance TA = 40qC to +85qC Typ 2.0 9.0 4.0 Max pF pF pF VCC = 0V VCC = 3.3, OE = 0V VCC and OE = 3.3 Figure Units Conditions Number Figure 11 Figure 10 Figure 11
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FSUSB23
Test Diagrams
Note: Each switch port is tested separately.
FIGURE 1. On Resistance
FIGURE 2. OFF Leakage
Note: RL, RS, and CL are functions of application environment (See AC Electrical table for specific values). Note: CL includes test fixture and stray capacitance.
FIGURE 4. Switch Propagation Delay Waveforms
FIGURE 3. AC Test Circuit Load
FIGURE 5. Turn ON/ Turn OFF Waveform
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FSUSB23
FIGURE 6. Switch Skew Tests
Note: RS and RT are functions of application environment (See AC Electrical Tables for specific values).
FIGURE 7. Bandwidth
FIGURE 8. Channel OFF Isolation
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FSUSB23
FIGURE 9. Non-Adjacent Channel-to-Channel Crosstalk
FIGURE 10. Channel ON Capacitance
FIGURE 11. Channel OFF Capacitance
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FSUSB23
Tape and Reel Specification
TAPE FORMAT for MircoPak
Package Designator
L10X
Tape Section
Leader (Start End) Carrier Trailer (Hub End)
Number Cavities
125 (typ) 5000 75 (typ)
Cavity Status
Empty Filled Empty
Cover Tape Status
Sealed Sealed Sealed
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Tape Size
8 mm
A
7.0 (177.8)
B
0.059 (1.50)
C
0.512 (13.00)
D
0.795 (20.20)
N
2.165 (55.00)
W1
0.331 + 0.059/0.000 (8.40 + 1.50/0.00)
W2
0.567 (14.40)
W3
W1 + 0.078/0.039 (W1 + 2.00/1.00)
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FSUSB23
Tape Format for DQFN
Package Designator
BQX
Tape Section
Leader (Start End) Carrier Trailer (Hub End)
Number Cavities
125 (typ) 2500/3000 75 (typ)
Cavity Status
Empty Filled Empty
Cover Tape Status
Sealed Sealed Sealed
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Tape Size
12 mm
A
13.0 (330)
B
0.059 (1.50)
C
0.512 (13.00)
D
0.795 (20.20)
N
7.008 (178)
W1
0.488 (12.4)
W2
0.724 (18.4)
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FSUSB23
Physical Dimensions inches (millimeters) unless otherwise noted
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm Package Number MAC010A
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FSUSB23
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Number MLP016E
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FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION As used herein: provided in the labeling, can be reasonably expected to result in significant injury to the user. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or 2. A critical component is any component of a life support (b) support or sustain life, or (c) whose failure to perform device or system whose failure to perform can be reasonwhen properly used in accordance with instructions for use ably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of terms
Datasheet Identification Product Status
Advance Information Preliminary Formative or In Design First Production
Definition
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
No Identification Needed
Full Production
Obsolete
Not In Production
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